die (Total 296918 Patents Found)

Die (296918 Patents Found)
A method and apparatus for controlling the die-retaining force of an extruder is disclosed. In the operation of an extruder adapted to retain a die with a container actuated by a container cylinder and effect extrusion of a billet readied for use in the container by forcing the billet through the die, to keep the die-r...
Analysis of a semiconductor die having silicon-on-insulator (SOI) structure is enhanced by accessing the circuitry within die from the back side without breaching the thin insulator layer of the SOI structure. According to an example embodiment, a portion of substrate is removed from the back side of a semiconductor di...
Elongated thin strip stock is blanked to form interlocking laminas for electric motor or generator rotors or stators at successive blanking stations. At a final assembly station the laminas are stacked and pressed into interlocking relationship. In response to an operator input a predetermined number of reversals, or h...
Modification of the connections between a die package and a system board is described. In one example a pattern redistribution module is used in a socket. The module has a first array of contacts on one side of the module. The contacts have a first configuration to connect to the socket. A second array of contacts is o...
A metering device for a hot chamber die-casting machine includes a casting container attachable to a crucible of the hot chamber die-casting machine, a riser channel in a riser channel area, and a casting piston unit for metered conveying of melt out of the crucible via the riser channel. A heating device is provided w...
A precision positioning device of a unit-type die cutting & hot stamping machine includes a positioning element on an input end of a first imprinting element and a positioning element on an output end of each imprinting element. Two neighboring positioning elements accomplish the positioning between the two positio...
A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A...
In an embodiment, an electronic component includes a dielectric core layer, one or semiconductor dies comprising a first major surface, a first electrode arranged on the first major surface and a second major surface that opposes the first major surface. One or more slots are arranged within the dielectric core layer a...
Breakage of the actuator moving the movable platen in the clamping device of an injection moulder is prevented. The clamping device includes a movable platen shifting device increasing and decreasing a horizontal distance between the movable platen ( 3 ) and the fixed platen ( 2 ). It includes an actuator ( 41 ), a cle...
An embedded chip package (ECP) includes a plurality of re-distribution layers joined together in a vertical direction to form a lamination stack, each re-distribution layer having vias formed therein. The embedded chip package also includes a first chip embedded in the lamination stack and a second chip attached to the...
Consistent with an example embodiment, there is a semiconductor wafer substrate comprising a plurality of integrated circuits formed in arrays of rows and columns on the wafer substrate. A plurality of integrated circuits are in arrays of rows and columns on the wafer substrate; the rows and the columns have a first wi...
A memory subsystem includes a multi-device package including multiple memory devices organized as multiple ranks of memory. A control unit for the memory subsystem sends a memory access command concurrently to some or all of the ranks of memory, and triggers some of all of the memory ranks that receive the memory acces...
The present invention relates to die-die stacking structure and the method for making the same. The die-die stacking structure comprises a top die having a bottom surface, a first insulation layer covering the bottom surface of the top die, a bottom die having a top surface, a second insulation layer covering the top s...
A forming mold or electroforming mother die including a mold or mother die, and a release layer composed of an organic thin film on a mold surface or mother die surface which is formed by contacting the mold or mother die with an organic solvent solution including a silane surfactant represented by formula [1] ...
Die Anmeldung betrifft ein Verfahren zur mehrschichtigen Materialabtragung einer beliebig geformten dreidimensionalen Oberfläche (1) mittels eines punktförmig auf eine Oberfläche wirkenden Abtragungsmittels (12), wie mittels eines Lasers (12), bei welchem eine Oberflächenstruktur (2) auf der dreidimensionalen Oberf...
Beschrieben werden Katalysatoren für die Zersetzung von N2O in Stickstoff und Sauerstoff in der Gasphase mit einem porösen Träger aus polykristallinem oder glasartigen anorganischem Material, einer darauf aufgebrachten Ceroxid- Funktionsschicht und einer darauf aufgebrachten Schicht aus oxidischem Kobalt enthaltende...
Die vorliegende Erfindung betrifft Vernebler zur Applikation von Flüssigkeiten auf die Augenhornhaut oder das Augenbindegewebe mit speziellen Augenaufsätzen für Vernebler und die Verwendung von Verneblern für die ophthalmologische Applikation. Die erfindungsgemäßen Vernebler sind treibgasfrei und besitzen einen E...
The present invention provides hard coating film which excels conventional surface coating layer in wear resistance, has lower frictional coefficient and better slideability, a material coated with the hard coating film, a die for cold plastic working, and a method for forming the hard coating film. The hard coating fi...
An integrated circuit system includes a first device wafer bonded to a second device wafer at a bonding interface of dielectrics. Each wafer includes a plurality of dies, where each die includes a device, a metal stack, and a seal ring that is formed at an edge region of the die. Seal rings included in dies of the seco...
A method and system for uniquely identifying each semiconductor device die from a wafer is provided. Identifying features are associated with device die bond pads. In one embodiment, one or more tab features are patterned and associated with each of one or more device die bond pads. These features can represent a code ...
A semiconductor die and a related method of processing a semiconductor wafer are disclosed in which a first interlayer insulator having a recess region of varying configuration and defining a scribe line is associated with at least one protective layer formed with a characterizing inclined side surface....
Lasing-free package methods for a semiconductor optical amplifier (SOA) die (2) are disclosed. The methods include: pasting a pad at a front end of the die component, and pasting a λ/4 wave plate rotated byφ=45 º onto the pad with certain areas overlapped, which makes it possible that the wave plate can completely c...
A die can be mounted on an already made pattern. Thereafter, substrate and other metal layers can be provided so as to embed the die in the substrate. This avoids the need to form a cavity in the substrate for die placement prevalent in conventional die embedding processes. As a result, die embedding process can be sim...